Excellence in 
surface measurement

cyberTECHNOLOGIES develops and manufactures
high-end 3D surface measurement systems
for industrial and scientific applications.

ProductsApplications

News

IMAPS 2017

50th Annual International Symposium on Microelectronics in Raleigh, NC, USA

WESTEC

Visit cyberTECHNOLOGIES at the WESTEC exhibition in Los Angeles, CA, USA.

EMPC 2017

cyberTECHNOLOGIES at the 21st European Microelectronics and Packaging Conference (EMPC) in Warsaw.

Explore the wide variety of applications

Thickness

Controlling the thickness of electronic devices (i.e. wafers) or measuring film thickness is essential.

Roughness

Non-destructive and fast surface roughness measurement according to international standards.

Flatness

Flatness measurement is required for a variety of components including wafers, optical and mechanical parts.

Coplanarity

Our optical systems even measure materials with different reflectivities  (i.e. BGA and flip chip bumps).

Questions?

We can help you finding the right measurement system for your application and budget needs.

Find the measurement system that suits your needs

Vantage 2

A compact profilometer specially designed for the use in production and clean rooms.

CT 350T

Designed for absolute thickness measurement independent of material and surface properties.

CT 300

Ideally suited for measuring surface areas up to 315mm. Available with an automated handling system.

Our customers

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