Flatness
measurement

Measuring the flatness of electronic components
and wafers

Flatness measurement is required for a lot of components including wafers, optical and mechanical parts. Using our non-contact 3D measurement technology, accurate flatness measurement can be achieved over large areas.

ELECTRONIC COMPONENT

Countour map of an electronic component

  • Advanced etch removing and modifiying algorithms
  • Use polygon shape cursors to mark region of interest

HARD DISK DEVICE

Contour map of hard disk device

  • Effective filters to separate flatness from surface roughness
  • Measuring the flatness relative to reference areas

Surface of a wafer

Surface of a wafer

  • Accurate flatness measurement over large areas
  • Colors can be set to specification limits

DIE TILT– LEADFRAME

3D Image die tilt

  • Measures Die Tilt, BLT height and Position
  • Rotation and offset relative to cavity center

Questions?

We can help you finding the right measurement system for your application and budget needs.