TTV

Thickness measurement in production processes and material testing is becoming more and more important. The CT T Series of cyberTECHNOLOGIES is specifically developed to measure both sides of parts like wafers, sheets, films or similar products. The system measures absolute thickness, thickness variation (TTV), bending and warpage, and with an adapter plate to the system can be used as a standard surface measurement system.

Thickness – Silicon Wafer

Thickness – Fuel Cell

Thickness – Solar Cell