IMAPS 2010
November 02 – 04, Raleigh, South Carolina
The 43rd International Symposium on Microelectronics will be held at the Raleigh Convention Center, Research Triangle, North Carolina, USA, and is being sponsored by the International Microelectronics And Packaging Society (IMAPS). IMAPS 2010 will feature technical tracks on 3D Packaging/Interconnect, Design, Reliability, Advanced Packaging and Material. 25 technical sessions will be featured this year including sessions on: 3D IC at RTP, 3D Packaging, 3D Systems Integration, 3D TSV Processes, Materials, Ceramics/LTCC, Flip Chip, WL/CSP, LED, MEMS, Modeling & Design, Pb-Free Solder, Printed/3D Structural Electronics, Thermal, Wire Bonding and more. This year’s symposium will also offer you 18 professional development courses, a GBC Marketing Forum on Photovoltaics and 3D, and keynote presentations from Dr. John Edmond, co-founder CREE Research, and Dr. Rao Tummala, Georgia Tech.