IMAPS 2011 – Long Beach
October 09 – 13, 2011, Long Beach Convention Center, Long Beach, California, USA
IMAPS 2011, Long Beach. The 44th International Symposium on Microelectronics is bringing together the entire microelectronics supply chain.
IMAPS 2011 will feature technical tracks on 3D Packaging; Modeling, Design & Reliability; Next Generation Materials; Assembly & Packaging; Advanced Technologies; and a Focus Track on Advanced Packaging & System-Integration. 28 technical sessions are planned this year including sessions on: 3D-TSV Processes & Materials; 3D TSV Interposers; 3D Packaging/Applications; Signal & Power Integrity; Package Reliability; Microwave/RF; Advanced Materials; Ceramic & LTCC; Thermal Management; Wire Bonding; Printed Electronics; Substrate Materials for Semicon/Solar; MEMS Packaging; and many more.