IMAPS Device Packaging 2011
March 08 – 09, Scottsdale / Fountain Hills, Arizona USA
The seventh Annual Device Packaging Conference (DPC2011) will be held in Scottdale,
Arizona, on March 7-10,2011. It is an international event sponsored and organized by
the International Microelectronics and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous
technical, social and networking opportunities for meeting leading experts in these fields.
The conference will attract a diverse group of people within industry and academia.
It provides a chance for educational ineractions across many different functional groups
and experience levels. People who will benefit from this conference include: scientists,
process engineers, product engineers, manufacturing engineers, professors, students,
business managers, sales and marketing.