cyberTECHNOLOGIES at the 22nd European Microelectronics and Packaging Conference (EMPC) in Pisa / Italy.
Surface measurement solutions for the Micro Electronics industry at SMTconnect 2019 in Nuremberg, Germany.
cyberTECHNOLOGIES in Asia at Productronica & Semicon China 2019 from March 20. – 22. in Shanghai, China.
Explore the wide variety of applications
Controlling the thickness of electronic devices (i.e. wafers) or measuring film thickness is essential.
Non-destructive and fast surface roughness measurement according to international standards.
Flatness measurement is required for a variety of components including wafers, optical and mechanical parts.
Our optical systems even measure materials with different reflectivities (i.e. BGA and flip chip bumps).
We can help you finding the right measurement system for your application and budget needs.
Find the measurement system that suits your needs
A compact profilometer specially designed for the use in production and clean rooms.
Designed for absolute thickness measurement independent of material and surface properties.
Ideally suited for measuring surface areas up to 315mm. Available with an automated handling system.