cyberTECHNOLOGIES wishes a happy Holiday Season and a prosperous New Year 2021.
Experience the fully automated surface measurement system with wafer loader and CT 350 with high-speed linesensor.
cyberTECHNOLOGIES at the 22nd European Microelectronics and Packaging Conference (EMPC) in Pisa / Italy.
Controlling the thickness of electronic devices (i.e. wafers) or measuring film thickness is essential.
Non-destructive and fast surface roughness measurement according to international standards.
Flatness measurement is required for a variety of components including wafers, optical and mechanical parts.
Our optical systems even measure materials with different reflectivities (i.e. BGA and flip chip bumps).
We can help you finding the right measurement system for your application and budget needs.
A compact profilometer specially designed for the use in production and clean rooms.
Designed for absolute thickness measurement independent of material and surface properties.
Ideally suited for measuring surface areas up to 315mm. Available with an automated handling system.