Excellence in
surface measurement
cyberTECHNOLOGIES develops and manufactures
high-end 3D surface measurement systems
for industrial and scientific applications.
Season’s Greetings
cyberTECHNOLOGIES wishes a happy Holiday Season and a prosperous New Year 2021.
SEMICON Europa & productronica
Experience the fully automated surface measurement system with wafer loader and CT 350 with high-speed linesensor.
EMPC 2019
cyberTECHNOLOGIES at the 22nd European Microelectronics and Packaging Conference (EMPC) in Pisa / Italy.
Thickness
Controlling the thickness of electronic devices (i.e. wafers) or measuring film thickness is essential.
Roughness
Non-destructive and fast surface roughness measurement according to international standards.
Flatness
Flatness measurement is required for a variety of components including wafers, optical and mechanical parts.
Coplanarity
Our optical systems even measure materials with different reflectivities (i.e. BGA and flip chip bumps).
Questions?
We can help you finding the right measurement system for your application and budget needs.
Vantage 2
A compact profilometer specially designed for the use in production and clean rooms.
CT 350T
Designed for absolute thickness measurement independent of material and surface properties.
CT 300
Ideally suited for measuring surface areas up to 315mm. Available with an automated handling system.
