EMPC 2017
cyberTECHNOLOGIES at the 21st European Microelectronics and Packaging Conference (EMPC) in Warsaw.
The EMPC 2017 will take place from September 10th to 13th 2017 in Warsaw at the University of Technology. For the first time the conference is organized in the eastern part of Europe.
cyberTECHNOLOGIES will take the opportunity to demonstrate its surface metrology systems and solutions for the Microelectronics industry. Visitors at the cyberTECHNOLOGIES-booth at the EMPC 2017 have the chance to get a free sample measurement at the CT 100. 
Take advantage of this oppertunity and schedule an appointment today.
The International Microelectronics and Packaging Society (IMAPS) is a worldwide organization, which leads communication, education and interaction at all levels in the field. IMAPS is dedicated to the growth of the community focused on developments of microelectronics and packaging technologies of the present and future, including 3D Integration, SMT, CoB and FC-Assembly, Embedding, Wafer Level Packaging, Encapsulation, Printed Electronics, MEMS, Photonics, HF, HT and Power-Electronics, Flexible Electronics, Advanced Materials, Thermal Management, Modeling/Design/Simulation, Reliability.
More about the EMPC 2017: www.empc2017.pl