We are pleased to announce our participation in SEMICON Europa 2026, taking place from November 10–13 at Messe München, Germany.
At our booth, we will showcase a selection of our advanced metrology systems, demonstrating how innovative measurement technologies can help manufacturers achieve greater precision, improve process control and increase production efficiency.
Visitors will have the opportunity to explore several measurement solutions and system configurations, including:
Thermal Warpage Measurement: A measurement platform designed to characterize warpage and deformation under varying thermal conditions.
High-Speed 3D Measurement for Trays and Boats: A system configuration featuring high-speed line sensor technology capable of capturing up to 22 million data points per second.
High-Speed White Light Interferometry (WLI): Advanced optical measurement technology for high-resolution surface characterization and precise 3D metrology.
Automated Wafer and Panel Metrology: Integrated measurement and handling solutions designed to support automated inspection and efficient semiconductor production processes.
Whether you are looking to improve measurement precision, optimize throughput or integrate automated metrology into your manufacturing processes, our team will be happy to discuss your specific applications and requirements.
Visit us in Hall C1, Booth C1619, to discover our technologies, explore potential solutions and connect with our experts.
Planning to attend SEMICON Europa but still need a day pass? Feel free to contact us. We will be happy to assist you.