cyberTECHNOLOGIES is pleased to participate in the SEMI 3D & Systems Summit 2025, taking place from June 25–27 at the Hilton Dresden Hotel.
As a key event in the semiconductor calendar, the summit brings together industry leaders driving advancements in heterogeneous integration, chiplets, hybrid bonding, and advanced packaging technologies.
We look forward to showcasing our latest high-accuracy metrology solutions and engaging with experts shaping the future of microelectronics at booth #5.
“SEMI Europe looks forward to welcoming global advanced packaging experts to Dresden,” said Laith Altimime, President of SEMI Europe. “With an exceptional speaker lineup and a sold-out exhibition, the Summit will spotlight critical advancements in chiplet technologies, hybrid bonding, and photonics – all essential for enabling next-generation intelligent systems and bolstering Europe’s technological resilience.”
This year’s SEMI 3D & Systems Summit will present a broad scope of topics including:
- Geopolitical Dynamics and Market Trends in a Global Semiconductor Landscape
- Chiplet Applications and System-Level Architectures
- Hybrid Bonding Technologies for Die-to-Wafer and Wafer-to-Wafer Integration
- Photonics and Co-Packaged Optics
- Innovation and Sustainability in 3D Integration
- European Readiness in Design, Materials, and Manufacturing
- NextGen Talent: Empowering Careers, Driving Growth