CSEAC 2025 in China

CSEAC fosters collaboration in semiconductors, packaging, and electronics — driving innovation, industry growth, and global technology leadership.

cyberTECHNOLOGIES will be taking part in the China Semiconductor Equipment Annual Conference (CSEAC), one of the leading gatherings for the semiconductor industry in China, taking place from September 4 – 6.

At this year’s CSEAC, we will highlight our advanced metrology solutions designed to support the growing complexity of semiconductor manufacturing. With increasing demands for precision, efficiency, and reliability, our technologies help manufacturers improve process control, optimize production, and enable the next generation of devices.

📍 Visit us at Booth A3-211 to learn more about our solutions.
🎤 Don’t miss our on-stage presentation on September 5 at 9:00 AM, where we will share how high-resolution metrology drives innovation in advanced packaging, wafer metrology, and hybrid bonding.

This conference brings together experts, innovators, and decision-makers to discuss the latest developments in semiconductor technology. It offers a unique opportunity to exchange ideas and explore new solutions for the challenges facing the industry today.

We look forward to engaging with the community at CSEAC in Wuxi and sharing how cyberTECHNOLOGIES is driving innovation in metrology for the semiconductor industry.

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3D & Systems Summit 2025

Where high-resolution metrology drives innovation in advanced packaging, chiplets, and hybrid bonding — enabling the next generation of semiconductor technologies.

Chiplet Summit 2025

cyberTECHNOLOGIES is proud to sponsor this year's Chiplet Summit 2025 in Santa Clara, where we will showcase our latest metrology solutions focued on chiplets.